Issue #6 | July 24, 2014
2014 IEEE EMC Symposium on EMC - Raleigh NC
It's not too late to join the record crowd attending
EMC & SI/PI 2014.
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Congratulations to the Authors of our
Best Paper Finalists!

 
Finalists for Best EMC Paper Award
 
On Modeling Wireless Radio-Frequency Energy Propagation in Below-Deck Ship Spaces
Gregory Tait and Carl Hager, Naval Surface Warfare Center (NSWC)-Dahlgren, Dahlgren, VA , USA
Presented during TU-AM-2 TC6 Spectrum Management
Room 306AB at 10:30 AM

On Intermittent OFDM Transmitter Saturation and Radar System Performance
Brian Cordill and Sarah Seguin, University of Kansas, Lawrence, KS, USA
Presented during TU-AM-2 TC6 Spectrum Management
Room 306AB at 11:00 AM

Operational Field Coupled ESD Susceptibility of Magnetic Sensor IC’s in Automotive Applications
Cyrous Rostamzadeh1, Rob Kado2, and Kimball Williams3, (1) Bosch, Plymouth, MI, USA, (2) Chrysler, Auburn Hills, MI, USA, (3) Dearborn, MI, USA
Presented during TU-PM-2 TC4 EMI Systems
Room 306AB at 4:30 PM

The Electric Field at the Surface of a Cylindrical Monopole
William Price and Benjamin Andros, The Boeing Company, Seattle, WA, USA
Presented during WED-PM-3 TC5 High Power EM Including Intentional EMI, ESD and Lightning
Room 306C at 3:30 PM

Physical Layer Phase Encryption for Combating the Traffic Analysis Attack
Fei Huo and Guang Gong, University of Waterloo,Waterloo, ON, Canada
Presented during WED-PM-4 SC4 Wireless EMC
Room 303 at 4:30 PM

Size of Devices to be Measured at 3 m
Andy Griffin, Cisco Systems Inc, San Jose, CA, USA
Presented during at TH-PM-3 TC1 Business and Management Concerns in EMC
Room 306C at 5:00 PM
 
Finalists for Best SIPI Paper Award

Time-Domain Mutual Coupling between Power-Ground Structures

Martin Stumpf, Brno University of Technology, Brno, Czech Republic
Presented during TU-PM-6-SIPI SI/PI High Speed Interconnect Design and Analysis I
Room 302C at 1:30 PM

Power Integrity Analysis for Core Timing Models
Dan Oh and Yujeong Shim, Altera, San Jose, CA, USA
Presented during TH-AM-6-SIPI SI/PI On-Chip and Off-Chip Power Integrity Issues and Design
Room 302C at 8:30 AM

Effective Roughness Dielectric in a PCB: Measurement and Full-wave Simulation Verification
Marina Koledintseva1, Tracey Vincent2, Antonio Ciccomancini2, and Scott Hinaga3, (1) Missouri University of Science and Technology, Rolla, MO,
USA, (2) CST of America, Framingham, MA, USA) (3) PCB Technology Group, Cisco Systems, San Jose, CA, USA
Presented during TH-AM-5A-SIPI SI/PI Package/PCB Material Characterization
Room 302B at 8:30 AM

Designing A 3D Printing Based Channel Emulator
Xiangyang Jiao1, Hui He1, Guanghua Li1, David Pommerenke1, Wei Qian1, Guangyao Shen1, Chong Ding2, Douglas White2, Stephen Scearce2, and Yaochao Yang2, (1) Missouri University of Science and Technology, Rolla, MO, USA, (2) Cisco Systems, Inc., San Jose, CA, USA
Presented during TH-PM-5-SIPI SI/PI Channel Emulation
Room 302B at 4:30 PM

An Accurate, Robust and Intuitive Technique to Detect Causality Violations in Broadband Frequency Measurements
Piero Triverio, University of Toronto, Toronto, ON, Canada
Presented during TH-AM-5b-SIPI SI/PI High Speed Interconnect Design and Analysis III
Room 302B at 10:30 AM
 

Check out these and all the New Paper
Presentations at EMC & SI/PI 2014.

USE OUR APPS TO PLAN YOUR DAY!


EMC 2014 Symposium      •      www.emc2014.org